High-Performance Computing Center
Wafer-Level Testing for the Compute Era
From CPUs and memory to AI processors, and on to advanced packaging and quantum computing, high-performance computing devices are driving an explosion of data. Our test and measurement products play a key role in bringing these devices to market.
Data Centers & High-Performance Computing
Data centers and high-performance computing (HPC) servers rely on high-performance CPUs, GPUs, AI processors and high-speed memory. As compute demand soars, chips operate at ever-higher frequencies with greater integration, placing higher demands on the accuracy, speed and RF performance of wafer-level testing.
Probes and probe station systems provide critical support for R&D and volume testing of logic, memory and AI processors, covering DC parametric testing, high-speed signal integrity testing and RF/mmWave testing — helping customers catch issues early and shorten time-to-market.
Related Products
Advanced Packaging & Quantum Computing
New technologies such as 2.5D/3D advanced packaging and Chiplet significantly increase device integration and interconnect density, requiring high-precision electrical testing of bare dies, TSVs and micro-bumps before and after packaging.
In quantum computing, wafer-level testing in cryogenic and magnetic environments has become a key requirement. Cryogenic probe test solutions support characterization of qubit chips near their operating temperature, helping scale quantum processors.
